TUMMALA, RAO R. <br/><br/>
INTRODUCTION TO SYSTEM-ON-PACKAGE (SOP): MINIATURIZATION OF THE ENTIRE SYSTEM 

 - 1ST ED. 
 - Estados Unidos  MCGRAW-HILL  2008 NEW YORK 
 - 785 
<br/><br/><label>ISBN: </label>9780071459068 
<br/><br/><label>LCCN: </label>78623 
<br/><br/><label>Subjects--Topical Terms: </label><br/>DISEÑO Y CONSTRUCCIÓN<br/>MODULOS MULTICHIP (MICROELECTRONICA)<br/>PAQUETE MICROELECTRONICO
<br/><br/><label>Dewey Class. No.: </label>621.381046